For a number of reasons, including cost, simplicity, power consumption, noise, etc., natural convection is the preferred approach for cooling electronic systems. However, it is often the case that natural convection is simply not sufficient to remove dissipated power while meeting other system requirements such as size. Therefore, cooling fans are commonly used to increase cooling capacity to achieve an adequate design. This series of two articles provides an overview of the basics of effectively integrating cooling fans into a system and understanding other impacts of the use of fans. YY Thermal heat sink. At higher velocities, the flow becomes turbulent and the heat transfer coefficient increases with velocity. While the surface temperature of a heat sink may be approximately uniform, YY Thermal cooling fans the fluid temperature increases as it absorbs energy, with the fluid temperature at any point in the system defined as Tfluid = ṁ * cp / Q' + Tinlet, where ṁ is the mass flow rate of coolant, CP is the specific heat of the coolant, Q' is the heat absorbed by the coolant to that point in the system, and Tinlet is the temperature of the coolant when it enters the system.
A larger flow rate can potentially affect heat transfer in two different ways:
1) by increasing the convection coefficient, which decreases the convective thermal resistance 1/hA.
2) by reducing how much the fluid temperature increases as it flows through the system. This effectively adds an additional thermal resistance, which may be referred to as the advective thermal resistance.
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