Point-of-care testing allows medical staff to accurately achieve real-time diagnostic results within an hour, rather than days. PCR-based point of care testing is considered the gold standard for diagnosing
Custom-designed for fanless operation from the ground up, the Heat Sink is capable of cooling modern high-end CPUs with low to moderate heat dissipation completely passively in enclosures with good natural convection.
Power densities in electronic subsystems continue to increase, driving demand for more cooling power alternatives that increasingly include liquid cooling as a viable candidate. To optimize thermal management efficiency, sustainability and reliability, designers of systems that use liquid cooling are exploring innovative combinations of component materials, including advanced thermoplastics,
There are trends that are driving the need for thermal interface solutions in the electronics marketplace. The first, is data consumption. As devices get more powerful to handle the amount of data that is being transferred over our IP networks, they are generating more heat. We’ve all heard of terabytes, gigabytes, megabytes, what about exabytes? A friend of mine, Larry, thinks the next one will be yotabytes.
We got a couple of questions embedded in here and it’s just sort of to get an idea. For example, this one, “Do you currently have a good understanding of when and how to utilize vapor chambers, as opposed to heat pipes?” So, we just get a feeling of feedback from the audience as to what their expertise level is, so if you can go ahead and vote on that and we’ll take a look at the results later on today.
YY Thermal now provides fans heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.
Generative design is an iterative design process that use of a program to generate a set of optimized designs that meet product performance requirements, Methods that transform statements of performance requirements into product designs are also known as inverse design methods
The role of a heatsink is to provide a conduction path from a heat source that is to be cooled to a volume of cooling fluid. The heatsink’s surface area that fills that volume is considerably larger than the surface area of the heat source
With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design.
There are so many items need heat managment,YY Thermal is expert in here,we have over 10years experience here.
For cost reduction I was thinking about the following:Complete Aluminium spreader block like in the other sample we received, instead of half copper.