CPU with new platform and new FIN chip structure and radiator with 120mm fan from Yuanyang Thermal, under the current trend of high-performance computers, 5 heat pipes have lower cost and ensure the corresponding heat dissipation performance.
As we know that technology in communication is changing from time to time, it’s just in the past the tech sphere from 1G to 2G was not that fast than from 4G to 5G, however, changing fast means human technology program has been raised up at a quicker speed.
The accomplishment of mini type medical water cooling block - small in size but with 400W extraordinary cooling performance.
Heat sink can consisted of many types, such like the extrusion, skiving and heat pipe radiators. However the most interested radiators that many people would like use and talk about is the heat pipe heat sink.
The welding is been a important process for the heat pipe radiator or we can say heat sink module, its features like high power, reliable cooling function and durable in lifetime using.
In Modern echnology. Skived heat sinks can be manufactured from either copper or aluminum. Today, skived heatsinks are breaking through the limitation of the thickness and length ratio of conventional heat sinks and our machines can produce high density and very high efficient heat sinks.
Extruded Heat Sinks are the most common heat sinks used for thermal management today. They are manufactured by pushing hot aluminum billets through a steel die to produce the final shape. The most common aluminum alloy is 6063-T5, but other 6XXX alloys can also be examined as needed. When the material is extruded, the initial sticks are 30-40 feet and length and are very soft. The material is stretched by grabbing both ends to produce a straight stick. After stretching, the material can be either air or over aged depending upon the required final hardness of the material.
The CPU water-cooled radiator refers to the use of liquid to forcibly circulate and take away the heat of the radiator driven by a pump.
As we know that nowadays that the thermal dissipation products had been innovated for many kinds, such like the air cooling with active cooling or passive cooling, air cooling heat sink is been a long while for the period of heat sink, or the representative heat sinks.
For high-advanced electronic products, it is required that the cooling structure occupies as little space as possible, the lighter the better, and the more reliable the better perform.
Vapor chamber is a vacuum chamber with microstructure on its inner wall. When heat is conducted from the heat source to the evaporation area, the working gadgets in the chamber will start to produce liquid phase evaporation in a low vacuum environment.
Background for techniques : The skiving heat sink breaks through the limitation of thickness-length ratio of conventional radiators, and can produce radiators with high density.