News

There are trends that are driving the need for thermal interface solutions in the electronics marketplace. The first, is data consumption. As devices get more powerful to handle the amount of data that is being transferred over our IP networks, they are generating more heat. We’ve all heard of terabytes, gigabytes, megabytes, what about exabytes? A friend of mine, Larry, thinks the next one will be yotabytes.

We got a couple of questions embedded in here and it’s just sort of to get an idea. For example, this one, “Do you currently have a good understanding of when and how to utilize vapor chambers, as opposed to heat pipes?” So, we just get a feeling of feedback from the audience as to what their expertise level is, so if you can go ahead and vote on that and we’ll take a look at the results later on today.

YY Thermal now provides fans heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.

Generative design is an iterative design process that use of a program to generate a set of optimized designs that meet product performance requirements, Methods that transform statements of performance requirements into product designs are also known as inverse design methods

The role of a heatsink is to provide a conduction path from a heat source that is to be cooled to a volume of cooling fluid. The heatsink’s surface area that fills that volume is considerably larger than the surface area of the heat source

With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design.

There are so many items need heat managment,YY Thermal is expert in here,we have over 10years experience here.

For cost reduction I was thinking about the following:Complete Aluminium spreader block like in the other sample we received, instead of half copper.

There are two kinds of mobile phone heat dissipation: Active heat dissipation and passive heat dissipation. The basic idea is to reduce the thermal resistance of mobile phone heat dissipation, among which (passive heat dissipation) or reduce the calorific value of mobile phone.

In daily life, any mechanical parts will be covered with dust after being used for a long time, and too much dust will also lead to the instability of the circuit and heat dissipation of the machine and hidden risks, just like the example around us: if the heat dissipation of the computer CPU is poor, it will easily lead to computer crash, automatic restart, slow operation and even CPU damage.

Nowadays, copper tubes have been used in electronic industries such as household appliances, water heaters, solar energy, automobiles, etc., and the demand is also increasing, which also makes the sales volume of copper tubes become better and better.

In our daily impression, the cooling system of PC computers generally uses air-cooled radiator, that is, aluminum fin sheet is attached to heat pipe and combined with fan to blow heat, and the air circulation in main box is used to keep the temperature of CPU heat source in the range of 20-60℃.