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Generative design is an iterative design process that use of a program to generate a set of optimized designs that meet product performance requirements, Methods that transform statements of performance requirements into product designs are also known as inverse design methods

With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design.

For cost reduction I was thinking about the following:Complete Aluminium spreader block like in the other sample we received, instead of half copper.

There are two kinds of mobile phone heat dissipation: Active heat dissipation and passive heat dissipation. The basic idea is to reduce the thermal resistance of mobile phone heat dissipation, among which (passive heat dissipation) or reduce the calorific value of mobile phone.

In daily life, any mechanical parts will be covered with dust after being used for a long time, and too much dust will also lead to the instability of the circuit and heat dissipation of the machine and hidden risks, just like the example around us: if the heat dissipation of the computer CPU is poor, it will easily lead to computer crash, automatic restart, slow operation and even CPU damage.

In our daily impression, the cooling system of PC computers generally uses air-cooled radiator, that is, aluminum fin sheet is attached to heat pipe and combined with fan to blow heat, and the air circulation in main box is used to keep the temperature of CPU heat source in the range of 20-60℃.

As we all know, the traditional radiator has a simple structure, only the heat pipe, fin chip and the contact bottom surface made of copper and aluminum, and even the heat sink is just the base of fin chip and flat surface produced by the simplest aluminum extrusion process, but it is widely used.

YuanYang Thermal Energy specializes in manufacturing water chill plates and heat sink dissipation modules in various fields, and has its own unique views on heat dissipation field.

Heat dissipation products not only have traditional and simple heat sinks, but also with the increasingly high-power mechanical and electrified products, heat sinks have derived new heat dissipation modules, which as the name implies, are composed of a variety of accessories and more diverse processes.

Aluminum extruded fins are widely used in many electronic products because of their wide variety and versatility. They can achieve certain cooling effect without a fan.

We can often see that there are many kinds of radiators, among which radiators in computers, servers and graphics cards are basically standard products, because these are products for many of consumers and mass production.

Aluminum extruded fins are widely used in many electronic products because of their wide variety and versatility. They can achieve certain cooling effect without a fan. In addition, the aluminum extruded radiator can be derived from a standard model size to develop another second product with the same size but slight differences, and can share a set of molds.